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Grinm Advanced Materials Co., Ltd. ("GRIAM"), originally known as Grinm Semiconductor Materials Co., Ltd., and solely sponsored by General Research Institute for Nonferrous Metals ("GRINM") through fund raising, was established in March 1999 and listed on Shanghai Stock Exchange with a registered capital of 838.78 million RMB. The registered address is No. 43 of Bei San Huan Zhong Lu, Haidian District, Beijing.

Precious metal packaging interconnection materials

Precious metal packaging interconnection materials
widely used in high reliability packaging of integrated circuits, micro optoelectronic devices, and high thermal conductivity packaging of high-power devices. The main products include gold tin solder pads, gold germanium solder pads, gold tin solder paste, etc. The performance indicators of the gold based solder produced by Grikin Advanced Materials Co.,Ltd have reached the advanced level in China.

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